In this video, we will restore a heavily destroyed iPhone 13 Pro. This iPhone 13 Pro’s screen and back cover are severely damaged.
Next, we install a known-good display to test the phone. The phone can be turned on. Face ID is unable to activate. There is no modem firmware.
Both the front and back cameras are not working.
In the first place, we replace the front and back cameras. Apply protection tape on the TrueDepth camera assembly.
After replacement, the back camera works again but only with 2x zoom. The front camera returns to function well. The malfunctioning modem firmware and cameras are caused by the motherboard middle layers
The next step is to remove the motherboard. The motherboard looks complete and not damaged. Attach the motherboard to the holder. As always, remove foam and dissipation tape.
Heat the motherboard at 170 °C. Add heat with a hot air gun at 330 °C. Remove the logic board.
It can be seen that there are many missing pads. Then clean the bonding pads with soldering iron at 370 °C and solder wick.
Open the bitmap to view the missing pads. There is only one missing pad that needs to be repaired.
Then we scrape to show the circuits under the pads. Clean the bonding pads with PCB cleaner.
Apply some middle-temperature solder paste. Solder with a hot air gun. Apply some paste flux. Put the soldering lugs in position. Solder with hot air gun again. After soldering, clean the bonding pads with PCB cleaner.
Apply some solder mask. Solidify with a UV lamp for about 1 minute. Scrape away residue solder mask to show the pads.
Then we need to recombine the motherboard. Apply some low-temperature solder paste to the bonding pads.
Put the signal board on the 170 °C heating platform to heat. After the solder balls are formed, apply some paste flux. Align the logic board. Keep heating the motherboard.
Install the motherboard for testing once it cools. Face ID is still not working. The modem firmware is restored. The rear camera works fine.
Then we inspect the TrueDepth camera assembly. Grind the metal plate. Remove the dot projector module. The CMOS of the infrared camera is damaged, which is unrepairable at the moment.
Next, we replace a brand-new back cover. Move flex cables and parts on the original back cover to the new cover. Apply new waterproof adhesive. Connect the display and turn on the phone. Everything else on the phone also works fine. That's as far as today's restoration goes.
One of the major appearance differences between iPhone 12 Pro and iPhone 13 Pro is that iPhone 13 Pro has a smaller notch. After the iPhone 13 Pro teardown, we find that the TrueDepth camera system of iPhone 13 Pro is less of the flood illuminator than iPhone 12 Pro. The missing flood illuminator is one of the reasons why the notch is smaller.
The front camera module of iPhone 13 Pro is also smaller than iPhone 12 Pro. The dot projector is moved to the middle with obvious outlook differences. We guess it may have something to do with the missing flood illuminator. The missing flood illuminator is probably integrated with the dot projector.
In this video of a repair case, REWA LAB will find out where the missing flood illuminator is and what influences the change of design by Apple will bring to Face ID repairs.
The Face ID of the iPhone 13 Pro is not available. Then we take apart the phone. Disconnect the battery and remove the display.
To avoid potential damage, apply high-temperature tape on the front camera module before repairing. Next, yank the motherboard, earpiece speaker and front camera module out.
In the first place, we connect the front camera module with the programmer. Then connect the phone to the computer. Click “Pearl Unbind”.
After unbinding, attach the front camera module to the holder. Carefully grind the metal plate with a grinding pen. Pry up the metal plate with a sculpture knife. Then cut the pin.
The next step is to remove the dot projector with hot air gun at 120 °C. It can be seen that the dot projector of iPhone 13 Pro is integrated with the flood illuminator. The CMOS of the infrared camera is put aside.
Then we remove the chip with hot air gun at 330 °C. Clean the bonding pads with soldering iron at 360°C. Keep cleaning the bonding pads with solder wick. Please do not damage the gold wire or smudge the CMOS during operations.Scrub the bonding pads with PCB cleaner.
Apply some paste flux to the bonding pads. Align the PCB board. Solder the board with hot air gun at 330°C
To facilitate subsequent IC soldering, we flatten the bonding pads. Then put the IC in position. Solder the chip with hot air gun at 330°C.
After that, we connect the flex cable with the programmer. Connect the phone with the computer. The new IC binds the phone successfully.
Next, we install the flex cable for testing. The settings of Face ID can be open and the flood illuminator works fine.
Then we need to assemble the front camera module. After alignment, apply some adhesive
Once the adhesive is set, install the front camera module. Connect the screen and battery. Turn on the phone. Face ID can be set up and works perfectly.
The flood illuminator of iPhone 13 Pro is integrated with the dot projector, which can make the notch smaller but brings new challenges for Face ID repairs. Compared to the old method of flex cable replacement and module transfer, the new way is more difficult and demanding for handwork. REWA LAB recommends non-professionals do not try this as it might damage the Face ID for good. We will keep you posted on the latest Face ID repair solutions for iPhone 13 series.