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STE-S102 Portable IC Chip Grinding Removal Pen
  • STE-S102 Portable IC Chip Grinding Removal Pen
  • STE-S102 Portable IC Chip Grinding Removal Pen
  • STE-S102 Portable IC Chip Grinding Removal Pen
  • STE-S102 Portable IC Chip Grinding Removal Pen
  • STE-S102 Portable IC Chip Grinding Removal Pen
  • STE-S102 Portable IC Chip Grinding Removal Pen
  • STE-S102 Portable IC Chip Grinding Removal Pen

STE-S102 Portable IC Chip Grinding Removal Pen

Price:
$0.00
Quality Grade:
OEM New
Quantity:

(MOQ: 1)

Shipping Fee:

$0.00 By Logistics to Country

Estimated shipping time: 1 - 10 working days
Total:

$0.00

STE-S102 Portable IC Chip Grinding Removal Pen 


In mobile repair industry, this grinding pen is mainly used for:

  • Grinding the IC chips, like CPU, NAND, etc.
  • Cutting the motherboard shielding cover which is hard to be removed by heating method
  • Rust or corrosive surface polishing



Features


Low Noise and Vibration

The machine keep operating quietly, smoothly for long time.

The high-quality aluminum alloy body helps efficient heat dissipation.


Large Capacity & Long Service Life

Built-in rechargeable lithium battery, grinding pen can continuously work about 2 hours when fully charged.

Compatible with most mobile phone chargers and power bank.


LED Light On The Head

Provide a better view when do the polishing and grinding, even use it in low light conditions.


Lightweight and Portable

Compared to the traditional grinding machine, this size is just like a pen, easy to carry and operate.

Just put it in your handbag and carry it conveniently wherever you go.

It makes your repair work more efficiency and convenient.




Specification


Voltage: 3.7 Volts

Power: 9W

RPM: 12000r/min

Power Source: Li-ion Battery

Grinding head: 2.35mm ceramics

Material: 6065 Aluminum Alloy

Size: 160*16mm

Product Weight: 58g



Item included


  • Grinding pen * 1
  • USB charging cable * 1
  • Plastic Grinding Head * 1
  • Metal Grinding Heads * 6
  • Sanding Rolls * 6



Tips:

Professional motherboard repair techniques and handwork skills are required during the grinding process.

Beginners should do more practice before do the grinding operation on the mobile device motherboard or screen.


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Packing


Carton box and foam packing

Packing size: 7*3.8*18.5cm

G. W.: 0.3Kg



After Sales Service


Please feel free to contact us for any problem at any time: service@rewa.tech






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