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MaAnt BGA Reballing Stencils For HUAWEI (P/Mate/Nova/V Series)

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MaAnt BGA Reballing Stencils For HUAWEI (P/Mate/Nova/V Series)

MaAnt BGA Reballing Stencils For HUAWEI (P/Mate/Nova/V Series)

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Quality:
OEM New
BGA Reballing Stencil:
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MaAnt BGA Reballing Stencil For HUAWEI (P/Mate/Nova/V Series)

 

Description

These stencils with 15 types can be heated by the hot air machine, it is easy and quick for reballing the IC and CPU of HUAWEI Motherboard.

 

Features

● High-quality steel sheet stencil, more durable

● Precise laser cutting for better alignment

● High-temperature resistance, not easy to get deformed

● The CPU and the common fault ICs are integrated into one stencil

● IC numbers are lasered on the stencil for reference, much easier to find


Specifications
Item Type: BGA Reballing Stencil
Material: Stainless Steel
Size: Standard Size
Color: Silver

 

MaAnt BGA Reballing Stencil For HUAWEI

Packing

Original carton box packing

 

Tips for Installation

●  Special tooling is required when GBA reballing the IC chips and CPU

● The installation of any new parts should be done by a qualified person. REWA is not responsible for any damage caused during installation.

 

After-sale service

Please feel free to contact us for any problem at any time: service@rewa.tech