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BGA Reballing Stencil for iPhone Motherboard Repair
  • BGA Reballing Stencil for iPhone Motherboard Repair
  • BGA Reballing Stencil for iPhone Motherboard Repair
  • BGA Reballing Stencil for iPhone Motherboard Repair
  • BGA Reballing Stencil for iPhone Motherboard Repair
  • BGA Reballing Stencil for iPhone Motherboard Repair

BGA Reballing Stencil for iPhone Motherboard Repair

Price:
$0.00
Quality Grade:
OEM New
Colour:
Silver
Model:
For iPhone 5C
For iPhone 5S
For iPhone 6
For iPhone 6 Plus
For iPhone 6S
For iPhone 6s Plus
For iPhone 5
For iPhone 4S
For iPhone 4
For iPhone 7
For iPhone 7 Plus
For iPhone SE
For iPhone 8
For iPhone 8 Plus
For iPhone X
Quantity:

(MOQ: 1)

Shipping Fee:

$0.00 By Logistics to Country

Estimated shipping time: 1 - 10 working days
Total:

$0.00

BGA Reballing Stencil iPhone Motherboard Repair Wholesale Suppliers


Description

This iPhone BGA reballing stencil using high-speed CNC technology and production. Apple iPhone PIEC/NAND/Hard disk 3D steel stencils, thickened steel

mesh. The precision hole position of the round square makes the steel mesh more durable, Easier to get rid of the net, more efficient, small white second change

master.


Compatibility

For iPhone 4~X


Specifications

● Japan imports steel sheet

● Eco-friendly material

● Laser cutting parameters

● Good flatness

● Medical grade

● High temperature resistance

● No deformation

● Anti-swell

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Packing

Zip-lock bag


Tips for Installation

●  Special tooling is required when GBA reballing the Apple iPhone 8 Plus.

●  The installation of any new parts should be done by a qualified person. REWA is not responsible for any damage caused during installation.


After-sale service

Please feel free to contact us for any problems at any time: service@rewatechnology.com

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