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BGA Planting Platform For iPhone X- 11 Pro Max
(MOQ: 1)
$0.00 By Logistics to Country
$0.00
BGA Planting Platform For iPhone X-11 Pro Max
Motherboard can be fixed and aligned accurately.
Square openings, tin beads uniform. BGA reballing without any damage
Specifications
Size: 10*8*0.4 cm (L*W*H)
Net Weight: 0.5 KG
Z13 For iPhone X/XS/XS Max
Z15 For iPhone 11
Z16 For iPhone 11 Pro/11 Pro Max
How to use
● Install the motherboard on the platform.
● Cover the motherboard BGA reballing stencil on main board.
● Evenly spread tin on the cover of the reballing stencil.
● Remove the reballing stencil cover.
● Take out the motherboard heat with the hot air gun to solidify the tin point.
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Packing
Original package + carton box
After Sales Service
Please feel free to contact us for any problem at any time: service@rewa.tech
MASTERS SELECT
Each online product has been carefully tested and selected by REWA masters to meet daily repair business needs.
QUALITY ASSURED
Each product must experience rounds of standardized quality control processes before shipment, All items on our website enjoy one-year warranty.
COMPETITIVE PRICE
REWA Team set the price based on the real quality of our product and service to guarantee our repair business customers that every penny you spent does worth it.
HASSLE-FREE SERVICE
Continuous high level of customer satisfaction is the goal that REWA has been relentlessly pursuing.
