$0.00 By Logistics to Country
The order processing time may take several days, after delivery from the warehouse, the delivery time depends on the shipping method
Weekdays do not include the following:
Saturday and Sunday
Motherboard can be fixed and aligned accurately.
Square openings, tin beads uniform. BGA reballing without any damage
Size: 10*8*0.4 cm (L*W*H)
Net Weight: 0.5 KG
Z13 For iPhone X/XS/XS Max
Z15 For iPhone 11
Z16 For iPhone 11 Pro/11 Pro Max
How to use
● Install the motherboard on the platform.
● Cover the motherboard BGA reballing stencil on main board.
● Evenly spread tin on the cover of the reballing stencil.
● Remove the reballing stencil cover.
● Take out the motherboard heat with the hot air gun to solidify the tin point.
Original package + carton box
After Sales Service
Please feel free to contact us for any problem at any time: firstname.lastname@example.org
|QUALITY GRADES CLASSIFIED BY MATERIALS AND FACTORY TYPES|
|OEM NEW||ORIGINAL and NEW from OEM factory|
|OEM USED||ORIGINAL but USED already, torn down from used/new devices|
|OEM REFURB||REFURBISHED NEW from ORIGINAL USED parts by replacing, cleaning, oxidation, polishing, etc. procedures|
|S+ GRADE||ORIGINAL materials and assembled by 3rd-party|
|A+ GRADE||COMPATIBLE materials and assembled by 3rd-party factory|
All products manufactured or supplied by shop.rewa.tech are provided a specific period of warranty based on date of purchase, unless otherwise stated. Please submit a warranty claim with RMA number assigned for return and refund if you have any related issues within the warranty date.
Please refer to the guide to get a RMA and initiate an after sales claim.
Scope of Warranty
● Order-related issues: Incorrect quantity, incorrect products and package damage.
● Quality-related issues: Non-artificial appearance defects and non-artificial function defects.
● Purchases from unauthorized resellers, products without REWA stamp, artificial defects and products out of warranty are not included.
After Sales Service Process