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MiJing 3D BGA Reballing Stencil For A8/A9/A10/A11/A12/A13
  • MiJing 3D BGA Reballing Stencil For A8/A9/A10/A11/A12/A13
  • MiJing 3D BGA Reballing Stencil For A8/A9/A10/A11/A12/A13
  • MiJing 3D BGA Reballing Stencil For A8/A9/A10/A11/A12/A13
  • MiJing 3D BGA Reballing Stencil For A8/A9/A10/A11/A12/A13
  • MiJing 3D BGA Reballing Stencil For A8/A9/A10/A11/A12/A13
  • MiJing 3D BGA Reballing Stencil For A8/A9/A10/A11/A12/A13
  • MiJing 3D BGA Reballing Stencil For A8/A9/A10/A11/A12/A13

MiJing 3D BGA Reballing Stencil For A8/A9/A10/A11/A12/A13

Price:
$0.00
Quality Grade:
OEM New
CPU Stencil:
For A8
For A9
For A10
For A11
For A12-1
For A12-2
For A13
Quantity:

(MOQ: 1)

Shipping Fee:

$0.00 By Logistics to Country

Estimated shipping time: 1 - 10 working days
Total:

$0.00

MiJing 3D BGA Reballing Stencil For A8/A9/A10/A11/A12/A13



Compatibility

For iPhone 6/6+/6S/6S+/7/7+/8/8+/X/XR/XS/XS Max/11/11 Pro/11 Pro Max


A8: For 6/6+

A9: For 6S/6S+

A10: For 7/7+

A11: For 8/8+/X

A12: For XR/XS/XS Max

A13: For 11/11 Pro/11 Pro Max


Click here to buy the whole set to save more



Features

  • High-quality steel sheet stencil, more durable
  • Precise laser cutting for better alignment
  • High-temperature resistance, not easy to get deformed
  • The CPU and the common fault ICs are integrated into one stencil
  • IC numbers are lasered on the stencil for reference, much easier to find



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Packing

Original carton box packing


Tips for Installation

●  Special tooling is required when GBA reballing the IC chips and CPU

● The installation of any new parts should be done by a qualified person. REWA is not responsible for any damage caused during installation.


After-sale service

Please feel free to contact us if any problems service@rewatechnology.com



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