REFOX Upgraded Laser Marking Machine (Mini Ver.)

REFOX Upgraded Laser Marking Machine (Mini Ver.) - OEM NEW

Description

This laser machine is used for separate mid-frame/bezel/back glass of more than 50 smartphone models, including iPhone/Samsung/Huawei/XiaoMi etc.  

Compared with the previous generation laser machine, the size and weight of this machine are significantly reduced (means you will be able to save a lot of shipping), but the efficiency can be kept consistent.

What can you do with the Laser Marking Machine?

● Back Cover Glass Disassembling(the most efficient way).

● Bezel Separating

● LOGO&Text Marking, for metal parts number engraving, gift recipient name engraving and so on

How to operate this machine?

Welcome to contact us to get the full user guide and a detailed operation video.

Specifications

● Equipment Size: 300*496*585mm

● Voltage: 220V/110V

● Plug Types: EU plug; US plug; UK plug.

● Laser Power: 20 W

● Total Power: not more than 800 W

● Making Accuracy:≤ 0.001 mm

● Making Speed: ≤10000 mm/s

● Cooling Method: built-in air cooling

● Laser Wavelength: 1.06 μm

● Power Supply: 220 V±10%, 50 Hz± 5%

● Ambient Temperature: -10℃~65℃

● Repeat Precision: ≤0.001 mm

● Marking Depth: 0.015-0.5 mm

● Marking Format: 175 mm x 175 mm

● Marking Line Width: 0.05-0.01 mm

● Equipment Weight: 18 Kg

● Gross Weight Including Package: 28.92kg

Note: Please remark the plug type you prefer before the payment.

      Please remark the standard voltage in your country before the payment.

      Highly recommend a professional operation.

REWA will not be held responsible for any damages to your smartphones that you may cause during the non-professional operation. 

We provide free operation consulting services, please contact us service@rewa.tech

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PACKING

EPE Foam + Plastic Film + Wooden Box

After Sales Service

Please feel free to contact us for any problem at any time: service@rewa.tech