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WYLIE Low Temperature Lead-free Solder Paste
  • WYLIE Low Temperature Lead-free Solder Paste
  • WYLIE Low Temperature Lead-free Solder Paste
  • WYLIE Low Temperature Lead-free Solder Paste
  • WYLIE Low Temperature Lead-free Solder Paste

WYLIE Low Temperature Lead-free Solder Paste

Price:
$0.00
Quality Grade:
OEM New
Colour:
Gray
Quantity:

(MOQ: 5)

Shipping Fee:

$0.00 By Logistics to Country

Estimated shipping time: 1 - 10 working days
Total:

$0.00

WYLIE Low Temperature Lead-free Solder Paste


Description

The low temperature lead - free solder paste is the best choice of repairing the mini-sized electronic equipment. It is also ideal for use in the PCB, SMT, plug-in

components, computer motherboards, phone motherboards, LED circuit boards, diversified lighting fixtures, as well as all sorts of high-precision circuit boards.

The low temperature lead - free solder paste is matched with iPhone X/Xs/Xs Max is professional BGA reballing stencil fixture for iPhone X/Xs/Xs Max.


Specifications

● Gross Weight: 50 g/bottle

● Melting point: 138℃

● Shelf life: 6 months


Features

● High-quality and high-purity tin ingot raw material fusion electrolysis special refining process, low welding speed, low residue, good conductivity and thermal

conductivity.

● Less residue after welding, transparent appearance, high insulation resistance, no corrosion of PCB, can meet the requirement of no-clean.

● Tin-bismuth alloy low melting point, so the soldering temperature is lower, which can effectively protect the electronic components are not damaged by the high

temperatures Rosin fewer residues.


The use tips of low temperature lead - free solder paste

● The low temperature lead - free solder paste should be stored in a 5-10 degree environment. The shelf life is 6 months.

● Before using the solder paste. Remove the solder paste from the refrigerator at least 4 hours. Let the solder paste restore to the working temperature.

Which can prevent moisture condensing on the surface of the solder paste, thereby reducing the generation of solder balls.

● To mix the solder paste evenly, stir the solder paste thoroughly after it returning to working temperature. Machine mix time is generally 1-3 minutes,

and manual mix time is generally 3-6 minutes.

● Use environment: temperature is 20-25 degrees, humidity is 35-65%.

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Packing

Original package + carton box


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